Can any of the aerospace folks here comment on how likely it is that this project violates ITAR or some other export restrictions, and the likely consequences?I'm pretty sure export restrictions don't apply if you're not actually exporting from the US. The phone was presumably made in China, by a Taiwanese company (HTC). The main CPU is a qualcomm snapdragon, which (according to Google) was fabricated in Taiwan at one point. Anyway, it seems pretty unlikely that there is any problem. I doubt that the click-through agreement on the phone bans people from launching their phones into space.
NASA PhoneSat engineers also are changing the way missions are designed by rapidly prototyping and incorporating existing commercial technologies and hardware. This approach allows engineers to see what capabilities commercial technologies can provide, rather than trying to custom-design technology solutions to meet set requirements. Engineers can rapidly upgrade the entire satellite's capabilities and add new features for each future generation of PhoneSats.It seems like there are a host of reasons why you don't want to take cues from the consumer electronics industry for objects permanently in orbit... it seems crazy to me to try to save 10K or 20K on a satellite which will cost millions of dollars to launch and is likely to be useless if there is even a software bug, much less some hard to fault-analyze hardware failure.
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I work in high-rel electronics. Specifically, I am a program manager for a company that makes MWD / LWD (Measurement-While-Drilling / Logging-While-Drilling) equipment. This is instrumentation, control and telemetry systems meant to be screwed into a drill string, just above the bit, when drilling for oil and gas. These systems have to survive hundreds to thousands of hours of spinning and bashing against rock at temperatures as high as 200 C / 400 F ... similar to the temperature you might bake a cake at.
Historically, the MWD / LWD industry has either purchased very specialized and expensive components for this application or taken unqualified, lower temperature parts and qualified them for higher temperatures, eg. 125, 150 or 175 C. We'd buy MIL-SPEC-883 qualified parts (mostly discontinued now), rated for 125 C, when we could and qualify them, or we'd buy industrial grade (85 C) or even commercial grade (70 C) parts and qualify them.
Increased demand for high-temperature-rated electronic components and subsystems for automotive, heavy industrial, aerospace and downhole applications has more recently led to a much broader offering of products which are or can be qualified for use up to 200 C.
In a totally unrelated development, Silicon-on-Insulator (SoI), Silicon Carbide (SiC) and Silicon-on-Sapphire (SoS) processes originally developed for high-speed, low-leakage applications, mainly cell towers and cell phones, are incidentally very well-suited for high-temperature applications; the higher-temperature capability came basically as a byproduct of this change, opening new markets to these vendors.
There have been similar, though arguably less dramatic developments in printed circuit board materials, solders, pottings, etc. that have followed developments in IC chips.
It could be said based on this article that the IC chip and printed circuit assembly reliability modeling, qualification and production screening techniques originally developed by the (mostly US) military, and to some extent Ma Bell, drove many of these improvements, trickled-down to consumer electronics and are now in a sense trickling back UP to a new breed of low-budget aerospace applications.
posted by ZenMasterThis at 7:29 PM on February 28 [8 favorites]